Hom-Lay Wang
D.D.S., M.S.D.
Professor and Director of Graduate Periodontics
(University of Michigan, School of Dentistry, Ann Arbor, MI)

Dr. Hom-Lay Wang, Endowed Collegiate Professor of Periodontics, Professor and Director of Graduate Periodontics at the University of Michigan, School of Dentistry. He is the author or co-author of 20 book chapters/invited reviews and more than 180 scientific articles.

Dr. Wang is a Director and Diplomate of the American Board of Periodntology (ABP), an Immediate Past-President of the Midwest Society of Periodontology, and a President-Elect, Board Director of the International Congress of Oral Implantologists (ICOI) and a Fellow of American College of Dentists. He serves as a Consultant for the ADA Commission on Dental Accreditation, an Associate Editor for The International Journal of Oral & Maxillofacial Implant as well as International Chinese Journal of Dentistry, Editorial Board member for the Journal of Periodontology, Clinical Oral Implants Research, International Journal of Peridodontics & Restorative Dentistry, Journal of Clinical Periodontology, Implant Dentistry, European Journal of Dentistry, The Open Dentistry Journal and many others.

Dr. Wang is the recipient of following awards/honors: AADS clinical research fellowship award (1992), Best Faculty Award (2003), The Charles E. English Annual Award in Clinical Science and Techniques (2004), Best papers in Journal of Oral Implantology (2005) and Implant Dentistry (2005) and Morton L. Perel Annual Award for Dental Implant Educator (2007). Dr. Wang's research focuses on guided tissue/bone regeneration in attempts to repair and/or regenerate various periodontal and implant-related defects as well as oral plastic surgery.

Because of his expertise in regeneration, he is the author of AAP position paper entitled "Periodontal Regeneration". Over the past 15 years, he has given more than 400 lectures at different professional and scientific congresses/courses and universities both in the United States and throughout the world.